UPM Event Deadline Third-party Event
Deconstructing the Challenges of Facility 2.0: Time-to-Market & Supply Chain Challenges in the Microelectronics Industry
Time-to-market has been a critical driver in the semiconductor industry for many years, driving technological competition between leaders in the market. However, current challenges go beyond typical reasons. The chip shortage provides unprecedented opportunity for all companies in the industry. Current market conditions require much larger manufacturing capacity, requiring massive expansion in the industry, resulting in unprecedented construction challenges. Facilities which are much bigger and complex than before must be built and commissioned in record times. All this is happening alongside geopolitical challenges and limited resources. The goal of this UPM Community event is to reveal specific needs and opportunities in the industry. Collaboration between all involved will be critical to produce creative ways of delivering time-to-market execution and minimize inefficiencies.
Deconstructing the Challenges of Facility 2.0: Environmental and Operational Sustainability
Continuing the trend of Moore's law, the demand for semiconductor products is exponentially increasing. More capable semiconductor products have created unprecedented opportunity, revolutionizing the world in the way that we know it. To keep up with this demand, the very large fabrication facilities become even larger and more complex. Manufacturing site power and water consumption is increasing, often exceeding the capability of available local and regional infrastructure. What makes this challenge even greater is the growing pressure of the corporate environmental sustainability commitments, which are becoming mission critical for most of the players in the industry.
This webinar will reveal more details related to this challenge. Thorough understanding of the problem is key for enabling solutions. IRDS recently formed new focus forum to deal with this task and help the supply chain with specific definitions of the technology gaps to enable solutions for the next generation fabs.
- Aaron Blawn, Corporate Services Site Manager, Intel
- Andreas Neuber, Director Environmental Services, Applied Materials
- John Painter, Director Business Development/Construction Specialized Solutions, Georg Fischer
- Josh Best, Vice President of Innovation, FTD Solutions
- Slava Libman, CEO, FTD Solutions
Wednesday September 28 2022 08:00 PST - Friday September 30 2022 12:00 PST
UPM 2022 ANNUAL CONFERENCEUPM event
The annual conference will be held from the 28th – 30th of September 2022. Please submit your abstract via this form by May 23rd 2022, at 11:59PM PST. Please find extended information about the conference theme, as well as what makes a successful submission, here.
In 2022, the scale of construction for manufacturing facilities is unprecedented. The next generation of fabs are not only huge in terms of footprint, but are also extremely complex, with EUV tools and 3D geometries included for the first time. The management of these facilities will be demanding, presenting a new scale of industry challenges.
As all facilities accelerate production to address the chip shortage, how can the industry find new and revolutionary ways to meet the needs of new fabs and to accelerate the time to market? A new business environment is required to address challenges surrounding the design, build, and magnitude of advanced facilities, whilst continuing to tackle the complexity of advanced devices. Moving forward, facility owners will need to address enormous energy needs, increased water use, increased chemicals, whilst also recovering from the stress of the supply chain caused by the pandemic. Methods used to manage legacy fabs in the past will no longer be enough. It is more important than ever that the sector collaborates to create a seamless and sustainable future for the industry.