Based in Santa Clara, CA, USA
Applied Materials is a world-leading technology provider of tools and software for the semiconductor industry, including metrology equipment, etching and photolithography systems and chemical-mechanical planarisation (CMP) technology, among others. In September 2021, Applied Materials announced new software modelling and simulation solutions for die-to-wafer and wafer-to wafer hybrid bonding. The new offering, along with innovations related to advanced substrates, is intended to help accelerate chip design and integration. The company also announced CMP technology to help silicon carbide chipmakers transition to 200mm wafers.