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Intel

Based in Santa Clara, CA, USA

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Intel is a leading chip manufacturer globally, supplying microprocessors for computer system manufacturers, with clients such as Lenovo, HP, and Dell. It also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel has 15 chip manufacturing sites, primarily in the US, but with some locations in Ireland, Israel, and China. Upcoming water projects include a partnership between Intel and the city of Chandler, Arizona, which will provide capital for a $25 million treatment plant to produce cooling water for two new semiconductor fabs. Construction for this project is expected to finish in July 2023.

In January 2022, Intel announced plans to invest $20 billion in two new semiconductor fabs in the Columbus, Ohio area. The project, which will begin construction in 2022 and enter chip production in 2025, will bring 3,000 jobs to the region.

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Id	Year	Materials	Info	Company	Author	Tags	View
...	2022	Please login or subscribe to view UPM Resources.	Keynote panel: Environmental footrpint A discussion about semiconductor facilities’ environmental footprint in relation to water consumption, energy usage, and site selection considerations.	...	Josh Best; Dane Louvier; Kelly Osborne	Water Conservation; Energy Conservation; Sustainability	View
...	2022	Please login or subscribe to view UPM Resources.	Study on How Ultrapure Water Could Contribute to Particle Types Identified on Wafer, and How Ion Exchange Resin Selection Could Make a Difference Particle contamination in ultrapure water (UPW) remains a high challenge in yield enhancement to achieve more functional die per wafer. IRDS requirement on acceptable particle size in UPW is getting more stringent year by year as semiconductor technology advances. Besides native particles, IRDS also shows growing concern on particle precursors such as dissolved molecular compound which may form solid particles when dried on wafer surface. Our study on the particle types released through a UPW system and its comparison to those found on wafers helps us identify the target particles and particle precursors to be removed from UPW. One of the target process consumables to be studied on the release of particles and particle precursors to UPW is ion exchange resin. Through our investigation on two different ion exchange resins, resin selection is shown to be critical in reducing the release of particles and particle precursors in both short and long terms.	...	Yoichi Tanaka; Hideaki Iino; Jas Cheong; Roberto Naranjo; Takeo Fukui, Karine Kenis, Jens Rip, Kurt Wostyn	Organic Contamination; Particles; UPW; IRDS	View
...	2022	Please login or subscribe to view UPM Resources.	PFAS - The Next Great Wastewater Challenge An overview of PFAS definitions and the regulatory environment, as well as destruction technologies and capability gaps.	...	Taimur Burki; Bob Leet	PFAS; Environmental Impact and Compliance; Wastewater Management	View
...	2022	Please login or subscribe to view UPM Resources.	Membrane Distillation: A Solution to PFAS Removal and Energy Optimization Due to the chemical properties (volatility) of PFAS, it is suspected that membrane distillation can efficiently remove these compounds from the different waste streams that occur in the semiconductor manufacturing industry. Additionally, the working principle of the technology (low-grade heat evaporation and distillation) will allow for the integration of a solution in an energy-efficient design where the waste heat generated in the facility will be reutilized for water purification.	...	Andreas Tornblom; Fiona Moclair	PFAS; Energy Conservation; Heat Recovery	View
...	2022	Please login or subscribe to view UPM Resources.	UPW Distribution Design, Operation, and Risk Management in Facility 2.0 The design of the UPW distribution system directly impacts the capacity required in the polish plant, as well as the performance and reliability of steady pressure control. Implementation of end-of-return pressure control is a well demonstrated tool for capacity and reliability management, but its benefits and limits must be quantified. Where previous fabs may have had just one end-of-supply or end-of-main pressure control valve, new fabs often have two or more. Multiple zones or submains require methodical management of risk where many control valves are in play.	...	Lindsey Sullivan; Dave Buesser; Robert Kirwan; John Croft	UPW System; Distribution Systems	View
...	2022	Please login or subscribe to view UPM Resources.	Why should you care about cafeteria grease trap cleaning? Airborne Molecular Contamination is a diverse field and requires many different approaches, Unlike particles, other most commonly known cleanroom contaminants, AMC's have various subclasses. Each of these subclasses, acids, basis, condensables, metallics, etc. many different analytical techniques. But, before even we reach the point of solving sources of excursion, we have to correlate defects and contaminants causing the said defects. The more obscure and infrequent the of defects are, the more difficult it is to find the source. In some cases by the time defects have manifested, the contamination has dissipated and if metrology for real-time analysis is not in place, it is near impossible to discover the root cause. This presentation uses example of such an excursion and goes through the process of "how to" find root cause of an excursion.	...	Latif Ahmed;	Airborne Molecular Contamination (AMC); Particle Count and Detection	View
...	2022	Please login or subscribe to view UPM Resources.	Streamlining Data Driven Decisions to Support Facility 2.0 Needs This presentation delivers considerations for water management decisions and modelling software to drive decisions for facility needs.	...	Gil Maron; Kelly Osborne	End-user; Data Management; Digital Solutions; Facility 2.0; Sustainability; Wastewater Management	View
...	2022	Please login or subscribe to view UPM Resources.	Facilities' Construction Panel A discussion of how the traditional construction roadmap is affected by the fast ramp of construction in the boom in semiconductor industry growth - with perspectives from an end-user, OEM, mechanical contractor and engineering firm.	...	Bob McIntosh; Dave Buesser; Alan Knapp; Chee Tan; Cordell Tietz	Construction; Supply Chain; End-user	View
...	2022	Please login or subscribe to view UPM Resources.	Keynote panel: Facilities' Growth A discussion of the drivers and constraints of semiconductor facilities' growth, including the talent shortage, construction approaches, site selection and commissioning.	...	Elizabeth Betancourt; John Painter; Alex Milshteen; Greg Jackson	Construction; Sustainability; End-user	View
...	2022	Please login or subscribe to view UPM Resources.	Digitalization Value A discussion of smart integration of digital technologies, processes and competencies across different levels and function within organizations.	...	Assaf Harel;	Construction; Digital Solutions; Data Management; End-user; Modeling	View