Speakers from Samsung, Intel, SCREEN, and FTD Solutions speak about why the semiconductor industry's resource consumption is dramatically increasing, as well as the water-energy relationship and other interrelated priorities which impact decision-making about sustainability.

A discussion about semiconductor facilities’ environmental footprint in relation to water consumption, energy usage, and site selection considerations.

Particle contamination in ultrapure water (UPW) remains a high challenge in yield enhancement to achieve more functional die per wafer. IRDS requirement on acceptable particle size in UPW is getting more stringent year by year as semiconductor technology advances. Besides native particles, IRDS also shows growing concern on particle precursors such as dissolved molecular compound which may form solid particles when dried on wafer surface. Our study on the particle types released through a UPW system and its comparison to those found on wafers helps us identify the target particles and particle precursors to be removed from UPW. One of the target process consumables to be studied on the release of particles and particle precursors to UPW is ion exchange resin. Through our investigation on two different ion exchange resins, resin selection is shown to be critical in reducing the release of particles and particle precursors in both short and long terms.

An overview of PFAS definitions and the regulatory environment, as well as destruction technologies and capability gaps.

Due to the chemical properties (volatility) of PFAS, it is suspected that membrane distillation can efficiently remove these compounds from the different waste streams that occur in the semiconductor manufacturing industry. Additionally, the working principle of the technology (low-grade heat evaporation and distillation) will allow for the integration of a solution in an energy-efficient design where the waste heat generated in the facility will be reutilized for water purification.

The design of the UPW distribution system directly impacts the capacity required in the polish plant, as well as the performance and reliability of steady pressure control. Implementation of end-of-return pressure control is a well demonstrated tool for capacity and reliability management, but its benefits and limits must be quantified. Where previous fabs may have had just one end-of-supply or end-of-main pressure control valve, new fabs often have two or more. Multiple zones or submains require methodical management of risk where many control valves are in play.

Airborne Molecular Contamination is a diverse field and requires many different approaches, Unlike particles, other most commonly known cleanroom contaminants, AMC's have various subclasses. Each of these subclasses, acids, basis, condensables, metallics, etc. many different analytical techniques. But, before even we reach the point of solving sources of excursion, we have to correlate defects and contaminants causing the said defects. The more obscure and infrequent the of defects are, the more difficult it is to find the source. In some cases by the time defects have manifested, the contamination has dissipated and if metrology for real-time analysis is not in place, it is near impossible to discover the root cause. This presentation uses example of such an excursion and goes through the process of "how to" find root cause of an excursion.

This presentation delivers considerations for water management decisions and modelling software to drive decisions for facility needs.

A discussion of how the traditional construction roadmap is affected by the fast ramp of construction in the boom in semiconductor industry growth - with perspectives from an end-user, OEM, mechanical contractor and engineering firm.

A discussion of the drivers and constraints of semiconductor facilities' growth, including the talent shortage, construction approaches, site selection and commissioning.