Orla McCoy

UPM Community Engagement Manager

Based in Oxford, UK

Intel; Tokyo Electron; Pall; Ovivo; Evoqua Water Technologies; Merck; Texas Instruments; Policy and Regulation; Company News; Projects;

News-in-brief: June 2022

A roundup of relevant industry news May 9 - June 19

CEA-Leti and Intel have optimized a breakthrough process for die-to-wafer self-assembly which relies on a water dispense technique. The surface tension of the water is appropriate for a hydrophilic bonding technique which improves alignment performance.  

Tokyo Electron released a new laser edge trimming system – named the Ulucus – which can replace wet edge trimming processes for 300mm wafers. Because the laser process is dry, the key value of the technology is that there is no requirement for ultrapure water rinsing, therefore contributing to opportunities to reduce water consumption.  

Market trends and investment 
SEMI announced that global semiconductor equipment billings grew 5% year-on-year to $24.7 billion in Q1 2022. Equipment billings for the quarter were highest in China, at $7.57 billion, followed sequentially by South Korea, Taiwan, North America and Japan. 

Pall Corporation announced a $100 million initial investment for a new manufacturing facility in Singapore which will produce filtration, separation and purification solutions for advanced node semiconductor manufacturers. The facility will primarily manufacture filtration for lithography and wet-etch processes. Phase one construction will begin in summer 2022, with high-volume manufacturing expected by Q1 2024.   
Several OEM systems suppliers announced the opening of new facilities this month. Ovivo has opened a new facility in Hungary which will specialize in the production of high-purity water treatment equipment for the pharmaceuticals and semiconductor industries. Meanwhile, Evoqua Water Technologies has opened a new facility in Singapore to produce continuous electrodeionization (CEDI) products to meet growing demand for UPW treatment technology in the APAC region. 
Merck Group announced a contract to open a production plant complex in Zhangjiagang, China to supply of semiconductor materials, including thin film materials and electronic-grade gases. The company will invest $83 million in the project over an unspecified time period. 
Intel revealed which construction companies are involved in phase one of its Ohio fab project. Fab construction, which is set to begin in 2022 and be completed by 2025, will be led by Gilbane Building Company, which will partner with McDaniel’s Construction Corp, NorthStar Contracting and GTSA Construction Consulting.  
Texas Instruments officially started construction of its new 300mm semiconductor fabs in Sherman, Texas and announced a total investment of up to $30 billion for the four planned facilities. The fabs are expected to begin production of analog and embedded processing chips in 2025. 
Policy and regulation 
The Spanish Government approved a €12.25 billion investment plan through 2027 to bolster the national semiconductor industry. To be funded by private-public partnerships, the Strategic Project for the Recovery and Economic Transformation of Microelectronic and Semiconductors (PERTE Chip) aims to strengthen R&D on cutting-edge chip architectures, promote the creation of fabless companies and incentivize advanced 5nm manufacturing plants. With this news, Intel and the Spanish Government announced plans for the company to invest €400 million in a microchip design laboratory in Barcelona.  
Intel is expected to receive $7.3 billion in public subsidies from the German Government for the newly announced Madgeburg fab complex. Construction of the $19 billion complex is planned to start in 2022 and be completed by 2027. 


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