450-MM PVDF Pipe and Fittings Production to Accommodate the UPW Volume Demands of Future Megafabs
Date published: 2013
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Industry experts are assured that 450nm wafers are the way forward for the semiconductor industry but to facilitate this innovation the industry will require advancements in piping systems constructed from polyvinylidene fluoride (PVDF). This article presents quantification data for one supplier's answer to the transition of such advancements and discusses unique injection molding production techniques, also focusing on recognized industry standards.
Authors: Hanspeter Mueller; Casey Williamson; Marty Burkhart; Matthais Trinkner
Tags: Leaching; materials of construction; piping