Device Yield and Reliability: Exploring Solutions for the Semiconductor Industry

The manufacturing of semiconductor devices requires the strict control and identification of particles and elements within the particles which contaminate the ultrapure water used in their production. Regulations advise that particles must be smaller than one half of the line-width of the device geometry, however currently available optical particle counters are restricted to measuring particles >40nm, therefore technology with the ability to identify elements within a particle <100nm does not currently exist. This article presents a new Metrology and Analytical Technology device intended to recognise contaminant elements in particles <50nm.

Constant developments in the microelectronics industry, with finer line widths and the requirement of essentially particle-free water, also brings with it many challenges involving the conservation and reuse of water, treatment of growing streams of wastewater produced from high-purity water from processes such as CMP, photolithography and etchant rinsing. This article provides an overview of featured keynote speakers, technical presentations on UPW and process water/wastewater as well as Roundtable Networking session at the UPW Micro 2015 conference.

UF even withstands episodic increase of particle numbers in the feed (e.g., caused by conditioning of ion-exchange resins) without negative effects for water quality and service lifetime. Such a particle challenge typically involves high concentrations of ~10-nanometer (nm) particles. On the other hand, current on-line particle counters approach their lower detection limit at about 10nm. Large numbers of particles nearby and below this limit remain undetected. Hence, the integrity of a UF membrane is essential to keep these small particles under control; it can hardly be evaluated by comparing particle counts upstream and downstream. Therefore, better test methods are needed to identify membrane damages, and to decide on service life and replacement of UF membranes.

This presentation was given as part of the Ultrapure Micro 2021 annual conference. It was given as part of the airborne molecular contamination (AMC) and high purity gases control strand.

This presentation was given as part of the Ultrapure Micro 2021 annual conference. It was given as part of the ultrapure water strand.

Ultrapure water (UPW) is one of the main materials for electronics fabrication and therefore, it needs to be monitored for critical parameters such as nanoparticles (NP). The state-of-the-art online measurement techniques are challenged by particles at the killer particle sizes smaller than 10 nm. Due to the uncertainties in NP detection, the identification of NP sources and sinks in UPW system is limited nowadays. This review article aims to give an overview on the current developments and perspectives in metrologies for detection and control. The following topics will be discussed: transferability of general definition of NP to UPW, state-of-the-art particle analytics, sources and sinks of NP in UPW systems as well as dominant particle interactions responsible for NP contamination. This article was originally published in the Ultrapure Micro Journal in November 2017.

This article provides an overview of the biggest challenge of UPW technology – particle control. The latest semiconductor technologies require near particle-free water, where the “killer” particle size is far below the size that UPW metrology can effectively detect. Also, current advanced treatment methods cannot guarantee reliable removal of killer-sized particles. The quality of the high-purity materials used downstream of the final filters has not typically been tested for shedding of the “killer” particles. Consequently, the semiconductor industry requires a comprehensive approach for the particle control. A new approach should include mitigating particle occurrence and continuously improving the technologies used in UPW polish and distribution systems. Such an approach should also include extensive use of SEMI standards to improve the quality of the materials used; a new way to engineer solutions related to system-configuration and system design; improved process control; and a careful review of critical operational decisions. Collaboration throughout the industry via IRDS and SEMI Standards is key to enabling such systematic improvement, and overcoming the metrology and other constraints. This article was originally published in the Ultrapure Micro Journal in November 2017.

This presentation was given at the Ultrapure Micro 2018 annual conference. It was presented in the Ultrapure Water Production track, as part of the Particle Analysis and Control in UPW session.

This presentation was given at the Ultrapure Micro 2017 annual conference. It was presented in the Ultrapure Water Production track, as part of the Enabling Advanced Fab Needs session.

This presentation was given at the Ultrapure Micro 2015 annual conference. It was presented in the Ultrapure Water Production track, as part of the Metrology session.