Study of Particle Attachment on Silicon Wafers During Rinsing

Date Published 2016 | Conference materials

Log in or Join UPM to access this content

To access our resources you will need to be a member of UPM, log in to your account or purchase a membership to view this content.

Already have an account? Log in

This presentation was given at the Ultrapure Micro 2016 annual conference. It was presented in the Ultrapure Water Production track, as part of the Technology Needs session.

Tags: ParticlesWafer Defectivity

Related content

UPW journal archive | 2013
Semiconductor Industry Trends Highlighted at UPW Micro 2012
Conference material | 2016
UPW ITRS and SEMI: Past – Present – Future of Enabling Advanced Existing and Future Technologies
Conference material | 2015
A Lithography-Based Explanation for UPW Improvement Needs
Spec Sheet - TSI AeroTrak® Cleanroom CPC

Back to results

Not a UPM Member?

Be part of year-round collaboration and knowledge exchange. Get access to the full range of tools leveraged by facility representatives and leading global experts from across the supply chain.

Book a demo

Find out how you can leverage UPM Member Portal to achieve your business objectives today.

Request a demo