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2022 |
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Critical Organics Risk Assessment of High-Purity Polymer Piping
Organic contamination present in Ultrapure Water (UPW) and other liquids pose a risk of depositing on the wafer surface during processing and cleaning. Of greatest concern are those deposits that are non-volatile. These are designated as “Critical Organics”. The objectives of this study are to quantify the extraction of critical organics from high-purity piping in hot UPW; specifically, PFA and PVDF, assess the affinity of the organic contaminants to the wafer surface during spin processing and to determine the relative concentrations of organic contamination remaining on the wafer surface as a function of temperature.
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CT Associates;
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Gary van Schooneveld;
Ali Altun;
Bob McIntosh;
Larry Zazzera
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Organic Contamination; UPW; Hot UPW; PFAS |
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2022 |
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Establishing Correlations between UPW Quality and Particle Deposition on Silicon 300 mm Wafer
In the yield enhancement report 2021 there is a call for highly controlled deposition experiments to determine the particle deposition rate on the wafer compared to the known particle count in the ultrapure water (UPW) to gain better understanding about the contamination sources on-wafer. The goal of this collaborative study between Lam Research as a tool supplier and Ovivo Switzerland as an UPW engineering company is to investigate potential correlation between UPW quality form a full scale UPW plant and particle deposition on standard silicon 300 mm wafer.
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Lam Research;
Ovivo;
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Philippe Rychen;
Alois Goller;
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Organic Contamination; Yield; UPW |
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2022 |
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On-wafer defectivity analysis of UPW with successive spin drying
Ultrapure water (UPW) is extensively used for cleaning and dilution purposes in fabs. A problem in UPW can have a fatal effect on wafer defectivity so that the final die yield. Therefore, it is crucial to characterize the risk of on-wafer defectivity of UPW at different stages of purification. The current 12-inch wafer testing methods are capital intensive requiring special equipment for both sample preparation and on-wafer particle scanning. Therefore, extensive application of on-wafer analysis of UPW is not a financially viable solution. This presentation will introduce a practical and economically feasible methodology to analyze the on-wafer defectivity of UPW using small wafers (2-inch or 4-inch). The method is based on applying the spin-drying process successively on the same wafer, increasing the particle density to a level higher than the existing particle baseline of the wafer.
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UNISERS;
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Ali Altun;
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UPW; Wafer Defectivity; Particles; High Purity Chemicals |
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2018 |
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IRDS and SEMI Standards Enabling Yield by Wet Processing Defect Control in Advanced Semiconductor Technologies
This presentation was given at the Ultrapure Micro 2018 annual conference. It was presented as a Keynote presentation.
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FTD Solutions;
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Slava Libman;
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IRDS; SEMI; Particles; Risk Management; Silica |
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2017 |
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UPW IRDS and SEMI: Reinforced Process of Enabling Advanced Existing and Future Semiconductor Technologies
This presentation was given at the Ultrapure Micro 2017 annual conference. It was presented as a Keynote presentation.
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Air Liquide;
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Slava Libman;
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IRDS; SEMI; Hydrogen Peroxide (H2O2); Silica; Particles |
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2016 |
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UPW ITRS and SEMI: Past – Present – Future of Enabling Advanced Existing and Future Technologies
This presentation was given at the Ultrapure Micro 2016 annual conference. It was presented as a Keynote presentation.
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Air Liquide;
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Slava Libman;
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IRDS; SEMI; Hydrogen Peroxide (H2O2); UPW System; Particles |
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2015 |
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UPW ITRS and SEMI: Synergy of Enabling Advanced Existing and Future Technologies
This presentation was given at the Ultrapure Micro 2015 annual conference. It was presented as a Keynote presentation.
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Air Liquide;
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Slava Libman;
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IRDS; SEMI; Ion Exchange; Filtration; Organic Contamination; Particle Count and Detection |
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