In 2022, UPM introduced a series of webinars deconstructing the challenges of Facility 2.0 and introduced the critical industry driver to improve chip yield and reliability. The growing role that semiconductors play in the world – such as high-performance computing AI, biometrics and sensors – drive new chip characteristics. 

3D chip structures, heterogeneous integration, and smaller technology nodes mean that critical defect sizes are at single-digit nanometer scales. Consumer demand for longer-lasting chips also puts pressure on contamination control needs. Quality specifications are harder than ever to meet, and they will only become more stringent. 

 

Whereas last year introduced the problem, the next UPM webinar Device Yield and Reliability: Exploring Solutions for the Semiconductor Industry will move towards discussing solutions. This will be the first in a three-part series moving towards solutions for Facility 2.0. How can engineers introduce measures to reduce the potential impact of metals and particles to the device? How can engineers control contamination when current analytical technologies are limited in detection capabilities? What are the best-known methods to produce the highest possible quality of pure liquids?  

Moderator: Bob McIntosh, Enviro-Energy Solutions

Confirmed speakers: