... |
2022 |
|
Deconstructing the Challenges of Facility 2.0: Device Complexity Drives Facility Complexity
A discussion of how the production of new complex devices is causing complications for the construction and operation of huge new semiconductor facilities.
|
... |
Dan Wilcox;
Anthony Jeffers; Brandon Ekberg; Danny Zhu; Nabil Mistkawi
|
Construction; High Purity Gases; High Purity Chemicals; Supply Chain |
View |
... |
2022 |
Please login or subscribe to view UPM Resources.
|
Keynote panel: Environmental footrpint
A discussion about semiconductor facilities’ environmental footprint in relation to water consumption, energy usage, and site selection considerations.
|
... |
Josh Best;
Dane Louvier; Kelly Osborne
|
Water Conservation; Energy Conservation; Sustainability |
View |
... |
2022 |
Please login or subscribe to view UPM Resources.
|
Keynote Panel: Yield and Reliability- Enabling Advanced Semiconductor Yield
A discussion of how contamination and defectivity control might be done differently in the future, to enable advanced semiconductor yield.
|
... |
Slava Libman;
James Snow;
Nabil Mistkawi, Abbas Rastegar
|
Yield; Wafer Defectivity; Organic Contamination; End-user |
View |
... |
2021 |
Please login or subscribe to view UPM Resources.
|
Electrodialysis reversal enhanced by ceramic membranes for recycling of copper wastewater
This presentation was given as part of the Ultrapure Micro 2021 annual conference. It was given as part of the water and wastewater management strand.
|
... |
Gregory Newbloom;
Stephanie Lopez;
Emma Feldman;
Michael Knapp;
Greg Newbloom
|
Copper; Membranes; Ion Exchange; Wastewater Reclamation and Reuse; End-user |
View |
... |
2021 |
Please login or subscribe to view UPM Resources.
|
Hydrogen Peroxide (H2O2) removal - GAC or enzyme approach
This presentation was given as part of the Ultrapure Micro 2021 annual conference. It was given as part of the water and wastewater management strand.
|
... |
Emma Feldman;
Stephanie Lopez;
Brian E Holton
|
Copper; Hydrogen Peroxide (H2O2); Ion Exchange; End-user |
View |
... |
2021 |
Please login or subscribe to view UPM Resources.
|
Diversion of Hydrofluoric acid (HF) and ethylene glycol mix to fluoride wastewater for treatment
This presentation was given as part of the Ultrapure Micro 2021 annual conference. It was given as part of the water and wastewater management strand.
|
... |
Victoria Yun;
Dan Wilson;
Britt Taylor-Burton
|
Environmental Impact and Compliance; Fluoride; End-user; Wastewater Reclamation and Reuse |
View |
... |
2017 |
Please login or subscribe to view UPM Resources.
|
Challenges and opportunities for particle control in advanced semiconductor manufacturing
This article provides an overview of the biggest challenge of UPW technology – particle control. The latest semiconductor technologies require near particle-free water, where the “killer” particle size is far below the size that UPW metrology can effectively detect. Also, current advanced treatment methods cannot guarantee reliable removal of killer-sized particles. The quality of the high-purity materials used downstream of the final filters has not typically been tested for shedding of the “killer” particles. Consequently, the semiconductor industry requires a comprehensive approach for the particle control. A new approach should include mitigating particle occurrence and continuously improving the technologies used in UPW polish and distribution systems. Such an approach should also include extensive use of SEMI standards to improve the quality of the materials used; a new way to engineer solutions related to system-configuration and system design; improved process control; and a careful review of critical operational decisions. Collaboration throughout the industry via IRDS and SEMI Standards is key to enabling such systematic improvement, and overcoming the metrology and other constraints. This article was originally published in the Ultrapure Micro Journal in November 2017.
|
... |
Slava Libman;
Dan Wilcox;
David Blackford
|
SEMI; Particles; Metrology and Analytical Technology; UPW Polishing |
View |
... |
2020 |
Please login or subscribe to view UPM Resources.
|
Proactive Solutions in Water Management for Advanced Semiconductor Manufacturers
Water management at advanced facilities has become increasingly complex. The manufacture of the new generation of technologies has increased water demands and posed new challenges for internal and external infrastructure. This webinar focused on proactive solutions and strategies based on recent developments in SEMI Standards. The panel then discussed risk management, environmental compliance, reliability issues and data management for water management challenges.
|
... |
Slava Libman;
Paul Kerr;
Alex Milshteen;
Philippe Rychen;
Dan Wilcox;
Michael Knapp;
|
SEMI; Wastewater Reclamation and Reuse; PFAS; Environmental Impact and Compliance; Data Management |
View |
... |
2020 |
Please login or subscribe to view UPM Resources.
|
Substrate Environment Contamination Control - The Manufacturing Tools Perspective
This webinar features a presentation from Nabil Mistkawi, Samsung Austin Semiconductor, who identifies key technology requirements for wet chemicals and gases from an end user perspective. This was followed by an engaging discussion between tool OEM companies and end users, as they explored the contamination control needs of individual environments, showing where contamination impacts the process, thereby bringing together the supply chain with the clean room.
|
... |
James Snow;
Rushi Matkar;
Dan Wilcox;
Slava Libman;
Abbas Rastegar; Jim Snow; Marcel Teunissen; Nabil Mistkawi
|
IRDS; Metrology and Analytical Technology; Wafer Defectivity; End-user; Ultraviolet (UV) |
View |
... |
2020 |
Please login or subscribe to view UPM Resources.
|
A Retrospective Review of AMC Issues: Our Understanding and Issues Incurred
This presentation was given at the Ultrapure Micro 2020 annual conference. It was presented in the AMC, Liquid Chemicals & Gases Control track, as part of the Airborne Molecular Contamination (AMC) and High Purity Gases Control session.
|
... |
Walter Den;
Cesar Garza
|
Airborne Molecular Contamination (AMC); End-user; Organic Contamination |
View |