News-in-brief: April 2022

Technology Researchers from South Korea’s Pusan National University, have developed a method, called atomic sputtering epitaxy, to fabricate oxidation-resistant copper thin films which could potentially replace gold in semiconductor devices. Such a method would reduce costs and increase the lifespan of nanocircuit devices. The research team found the copper thin films to be almost defect-free when investigating with high-resolution electron microscopy equipment. Scientists from Singapore’s Nanyang Technological University and the South Korea Institute of Machinery and Materials have developed a technique for optimizing wafer yield through chemical-free nano transfer-based printing. The technique transfers gold nanostructure layers onto a silicon substrate at low temperatures, allowing the wafer to be fabricated uniformly, achieving more than 99% yield. The method was successful on a six-inch wafer and researchers believe scaleup to a twelve-inch wafer is possible. Toray Industries announced a new series of ultra-low-pressure reverse osmosis membrane elements. The offering is intended to improve rejection of silica, boron and other neutrally charged molecules from water by doubling the neutral molecular component rejection compared to the company’s conventional product line. Currently targeting ultrapure water production for semiconductor manufacturing, Toray plans to broaden the products’ applications to include wastewater reuse. Market trends and investment Intelannounced more than €33 billion in initial investments for EU-based R&D and manufacturing, which is part of a plan to invest as much as €80 billion in the region over the next decade. The €33 billion expenditure plan includes €17 billion for a leading-edge mega-fab in Germany and a new R&D hub in France, with more R&D and manufacturing capabilities in Ireland, Italy, Poland and Spain. Construction of the upcoming mega-fab in Germany is expected to begin in H2 2023, with production planned for 2027. As part of the €33 billion investment, Intel is also spending an additional €12 billion to double manufacturing capacity at its Leixlip, Ireland site, which will bring Intel’s total investment in Ireland to more than €30 billion so far. According to TrendForce, a market research organisation focused on price trends for microelectronics markets, prices for 3D NAND wafers have appreciated 5-10% in Q2 2022due to material contamination at Kioxia fabs in Japan in early February. Clients are reportedly looking to Samsung and Solidigm to fill supply gaps. Company news A 7.3 magnitude earthquake in northeast Japan has caused several fabs there to suspend production. Renesas Electronics, a major supplier of automotive chips, completely halted production at two of its semiconductor facilities, and partially stopped production at a third. One of the fabs ramped up to full production within two days, while the others became fully operational after 10 days. Toyota – a major purchaser of Renasas chips – does not expect the disruptions to have a major impact on automotive production. A separate 6.0 magntitude earthquake in eastern Taiwan had minimal impact on the domestic semiconductor industry. Powerchip’s operations were disrupted for up to three hours and UMC’s production equipment suffered minor damage. Projects A joint venture between Kioxia and Western Digital will see construction of a new fab begin in April 2022, with completion expected by end-2023. The fab, to be located in Kitakami, Japan, will supply 3D flash memory chips. Investment details have not yet been disclosed. Edwards Vacuum will invest an unspecified amount in a new Chandler, Arizona-based manufacturing facility for gas abatement and vacuum solutions. Construction is set to begin in Q3 2022. The investment follows news that Edwards Vacuum has agreed to acquire Ceres Technologies, a US-based manufacturer of gas and vapour delivery equipment for semiconductor manufacturing. The acquisition’s value is also undisclosed, but the deal is expected to be finalised in Q2 2022. Hager + Elsässerwas awarded a contract to design, supply and construct a wastewater treatment plant (WWTP) for an unnamed semiconductor facility in Asia. The WWTP will be completed in 2023 and is expected to be one of the largest in the region for the semiconductor industry. Financial details of the contract have not been disclosed.